Ohmite’s R2 Series (patent pending) heatsink provides a large surface area along with our C Series clipping mechanism to attach either a TO-220 or TO-247 package. The self-aligning features of the clip assure secure attachment and enhanced thermal performance. Because no screws are required for device mounting, additional fins can be added to the rear side of the heatsink for increased total surface area in a more compact space.

The unique design (patent pending) of the W Series heat sinks combines a tin plated, solderable, integral spring clip with an extruded aluminium heat sink body for an all-in-one solution to through-hole mounting of TO-220 or TO-247 packages. These self-aligning heat sinks feature solderable feet and an integrated clip with 13.2 (lbf) of force on the centre of the device to enhance thermal performance.

Ohmite introduces the C series (Pat. Pending). This series offers high performance, low cost and a compact heat sink with an integrated camming clip system for TO-247 packages (TO-220 and TO-264 available). This powerful heat sink provides tool and fixture free assembly operation, largest surface areas and smallest space occupation. It is the ideal type of heat sink for high power density and small size (1U or 2U) electronic packaging with forced convection cooling.

Four Terminal High Precision Current Sense

• Designed for automatic insertion
• Industry standard sizes
• High precision kelvin connect capability in a small package